Thermal interface materials

ABSTRACT

A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. application Ser. No.17/316,055, filed May 10, 2021, which is a continuation of U.S.application Ser. No. 17/165,363, filed Feb. 2, 2021, which is acontinuation of PCT Application No. PCT/US2020/044286, filed Jul. 30,2020, which claims the benefit of and priority to U.S. ProvisionalApplication No. 62/880,370, filed Jul. 30, 2019, the contents of each ofwhich are incorporated herein in their entirety.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The invention disclosed herein relates to thermal interface materialsand, in particular, to composite materials for providing efficienttransfer of heat away from electronic components.

2. Description of the Related Art

As electronics continue to shrink in size while increasing incapabilities, a very real and limiting concern is that of heatgeneration. That is, the performance of high-density circuits may suffersubstantially without effective heat dissipation. One important set oftools in heat dissipation includes a variety of thermal interfacematerials.

The term “thermal interface material” (also referred to herein as “TIM”)generally describes any material that is inserted between two parts inorder to enhance the thermal coupling between the two components. Manydesigns involve use of thermal interface material inserted between aheat producing device (e.g., the heat source, such as a processor) and aheat dissipation device (e.g., the heat sink).

There are several kinds of thermal interface materials commonly used.These include thermal grease, thermal adhesive, thermally conductivepads, thermal tape, and phase change materials.

Thermal grease results in a thin bond line and therefore a small thermalresistance. Thermal grease has no effective mechanical strength andtherefore requires an external mechanical fixation mechanism. Becausethermal grease does not cure, use is limited to where the material canbe contained or in thin applications where the viscosity of the greasewill allow it to stay in position during use.

Thermal adhesive or thermal glue provides some mechanical strength tothe bond after curing. Thermal glue allows a thicker bond line than thethermal grease as it cures.

Thermally conductive pads are generally mostly made of silicone orsilicone-like material. Thermally conductive pads have the advantage ofbeing easy to apply and allowing thicker bond lines. Typically,thermally conductive pads require higher force to press the heat sink onthe heat source so that the thermal pad will conform to the surface of aparticular device. This can be problematic or prohibitive for sensitivedevices where any deformation will result in signal interference.

Thermal tape may be used. Generally, thermal tape adheres to a surface,requires no curing time and is easy to apply. Thermal tape is similar toa thermal pad with adhesive properties.

Phase-change materials (PCM) may be used. Generally, phase-changematerials are naturally sticky materials and may be used as replacementof thermal greases. Application is similar to solid pads. After reachinga melting point, typically about 55-60 degrees Celsius, the phase-changematerials will change to an at least partially liquid state and fill allgaps between heat source and heat sink.

These and other embodiments of thermal interface materials make use of avariety of compositions. Some embodiments of compositions includedispersions of dimensional materials. For example, some compositions mayinclude thermally conductive fibers. In some embodiments, carbonnanotubes may be included. While such embodiments may have shown somepromise, demand for performance requires further improvement.

That is, unfortunately, advances in circuit design have outpacedimprovements to heat dissipation technologies. While the foregoing typesof thermal interface materials have served present day electronics,advances in system designs are increasingly constrained by heatgeneration.

What are needed are improved technologies for heat dissipation inelectronic systems.

SUMMARY OF THE INVENTION

In one aspect, a thermal interface material is disclosed including asheet extending between a first major surface and a second majorsurface, the sheet including a base material and a filler materialembedded in the base material. The filler material includesanisotropically oriented thermally conductive elements. In someembodiments, the thermally conductive elements are preferentiallyoriented along a primary direction from the first major surface towardsthe second major surface to selectively promote thermal conductionthough the sheet along the primary direction. In some embodiments, thebase material is substantially free of silicone. In some embodiments,the thermal conductivity of the sheet along the primary direction is atleast 15 W/mK, 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80W/mK, 90 W/mK, 100 W/mK, or more.

In another aspect, a method of making a thermal interface material isdisclosed, the method including following steps. In a step, forming astack comprising a plurality of layers. In some embodiments, each layercomprises a base material, and a filler material comprisinganisotropically oriented thermally conductive elements. In someembodiments, each layer extends from a bottom surface to a top surfacealong a vertical direction, and the layers are stacked in said verticaldirection. In some embodiments, the thermally conductive elements ineach layer are anisotropically oriented to preferentially promotethermal flow in directions transverse to the vertical direction.

In a further step, applying force to the stack to compress the stackalong the vertical direction. In some embodiments, this compressioncauses the layers of the stack to join and form a monolithic element.

In a further step slicing the stack along a plane extending in thevertical direction and transverse to the top and bottom surfaces of thelayers to form a sheet. In some embodiments, the sheet extends between afirst major surface and a second major surface and includes a portion ofthe base material and the filler material cut from the stack. The fillermaterial includes anisotropically oriented thermally conductive elementsthat are preferentially oriented along a primary direction from thefirst major surface towards the second major surface to promote thermalconduction though the sheet along the primary direction.

Various embodiments may include any of the features and elementsdescribed herein, either alone or in any suitable combination.

BRIEF DESCRIPTION OF THE DRAWINGS

The features and advantages of the invention are apparent from thefollowing description taken in conjunction with the accompanyingdrawings in which:

FIG. 1 is a schematic diagram depicting aspects of a heat generatingcomponent, a heat sink and use of thermal interface materials;

FIG. 2 is a schematic diagram of a thermal interface material pad;

FIG. 3 is an illustration of a surface treatment for the thermalinterface material pad of FIG. 2;

FIG. 4 is a plot of thermal impedance vs. pressure for six samples ofthermal interface material pads. The upper three traces show results forsamples without surface treatment. The lower three traces show resultsfor samples with surface treatment of the type illustrated in FIG. 3;

FIG. 5 is a schematic diagram of an alternate embodiments thermalinterface material pad;

FIG. 6A is an illustration of the initial steps in a method offabrication of a thermal interface pad of the type shown in FIG. 2;

FIG. 6B is an illustration of the final steps in a method of fabricationof a thermal interface pad of the type shown in FIG. 2;

FIG. 7A is an illustration of the initial steps in a method offabrication of a thermal interface pad of the type shown in FIG. 5;

FIG. 7B is an illustration of the final steps in a method of fabricationof a thermal interface pad of the type shown in FIG. 5;

FIG. 8 is a schematic diagram depicting aspects of another example ofthermal interface material that includes a dispersion of dimensionalmaterial;

FIG. 9 is a schematic diagram depicting aspects of another example ofthermal interface material that includes a dispersion of dimensionallyoriented materials;

FIG. 10 is a depiction of a block of stacked thermal interface materiallayers, each layer made up of a dispersion of dimensionally orientedmaterials such as those shown in FIG. 9;

FIG. 11 is a depiction of a thermal interface material pad containingdimensionally oriented material, which could be cut from a block likethat shown in FIG. 10;

FIG. 12 is a graph depicting thermal performance for the oriented paddisclosed herein in comparison to competitive products; and,

FIG. 13 is graph showing comparative performance of embodiments ofthermal interface materials.

DETAILED DESCRIPTION OF THE INVENTION

Disclosed herein are embodiments of thermal interface materials alongwith methods for fabricating and using the thermal interface materials.Generally, the thermal interface materials exhibit a high degree of heatconductivity and further provide anisotropic heat dissipation.

Prior to introducing the thermal interface materials (TIM), someterminology is provided to establish context for the teachings herein.

Generally, the term “self-healing” refers to materials that have thebuilt-in ability to automatically repair damage to themselves withoutany external diagnosis of the problem or human intervention. Typically,conventional materials will degrade over time due to fatigue,environmental conditions, or damage incurred during operation. Cracksand other types of damage on a microscopic level have been shown tochange thermal, electrical, and acoustical properties of theconventional materials, and the propagation of cracks can lead toeventual failure of the conventional material. In general, cracks arehard to detect at an early stage, and manual intervention is requiredfor periodic inspections and repairs. In contrast, self-healingmaterials counter degradation through the initiation of a repairmechanism that responds to the micro-damage.

Generally, “thermal conductivity” (often denoted as k, λ, or κ) refersto the ability of a material to conduct heat. Thermal conductivity isevaluated primarily in terms of Fourier's Law for heat conduction. Ingeneral, thermal conductivity is a tensor property, expressing theanisotropy of the property.

Heat transfer occurs at a lower rate in materials of low thermalconductivity than in materials of high thermal conductivity.Correspondingly, materials of high thermal conductivity are used in heatsink applications and materials of low thermal conductivity are used asthermal insulation. The thermal conductivity of a material may depend ontemperature. The reciprocal of thermal conductivity is called “thermalresistivity.”

Thermal conductivity may be expressed as provided in Eq. (1):

$\begin{matrix}{\overset{\rightarrow}{q} = \left( {{- k}\underset{\nabla}{\rightarrow}T} \right)} & {{Eq}.\mspace{14mu}(1)}\end{matrix}$

where

$\overset{\rightarrow}{q}$

represents the thermal conductivity, and

$\left( {\underset{\nabla}{\rightarrow}T} \right)$

represents the temperature gradient.

Generally, as discussed herein, the term “thermal impedance” refers tothe sum of thermal resistance and all contact resistances for amaterial. When thermal impedance is lower for a material, the materialis a better thermal conductor in that application. Thus, factors such assurface roughness, surface flatness, clamping pressure, presence ofadhesive, non-homogeneous, and material thickness are factors thatinfluence thermal impedance for a material. Generally, thermal impedanceis a useful metric for assessing thermal performance, as thermalimpedance accounts for more variables specific to the application.

As used herein, an “isotropically oriented” set of elements is to beunderstood to be randomly or substantially randomly arranged such thatthe elements are not preferentially aligned or are not substantiallypreferentially aligned along a particular direction in space.

As used herein, an “anisotropically oriented” set of elements is to beunderstood to be arranged such that the elements are substantiallypreferentially aligned along a particular direction in space.

Referring now to FIG. 1, aspects of a heat management system for anelectronic device are shown. In the heat management system 1 shown, aheat source 5 generates heat. Non-limiting examples of the heat source 5include a least one of a processor, memory, a power supply, a powerconverter, a light emitting diode and a laser diode. Generally, the heatsource 5 is mounted to a support 4. A non-limiting example of thesupport 4 is a printed circuit board (PCB). In this illustration, theheat source 5 is surface mounted onto the support 4. A first depositionof thermal interface material (TIM) 10 is directly on top of and inthermal communication with the heat source 5. A heat spreader 7 isdisposed over the first deposition and in thermal communicationtherewith. On top of the heat spreader 7 and in thermal communicationtherewith is a second deposition of thermal interface material (TIM) 10.A heat sink 2 is disposed over the second deposition and in thermalcommunication therewith.

When energized, the heat source 5 generates heat. The heat is conductedaway from the heat source 5 by the depositions of thermal interfacematerial (TIM) 10 along with the heat spreader 7 and the heat sink 2.Generally, the depositions of thermal interface material (TIM) 10enhance heat conduction between the heat source 5 and the heat sink 2 byelimination of gaps and air space between the components.

Generally, the heat sink 2 is a traditional cooling solution thatmaximizes the surface area (using fins or pins) and airflow (using fans)to dissipate heat from the heat source 5 out into the surrounding air.The heat sink 2 may be built with cooling fans as a simple, lightweight,and completely self-contained cooling solution. Depending on theavailable airflow, the heat sink 2 can often out-perform a similar sizedheat spreader 7.

Generally, the heat spreader 7 has a large, flat surface on top. In someembodiments, the heat spreader 7 has no fan and no fins. The heatspreader 7 may be pressed directly up against another large flat surface(for example: the frame of a vehicle or the inside wall of a sealedcontainer) and heat is allowed to pass from the heat spreader 7 out tothe larger metal (thermally conductive) surface. In typical designs, theheat spreader 7 does not cool the heat source 5 (e.g., a CPU) alone.Rather, the heat spreader 7 is designed to transfer the heat to anotherobject where it can safely dissipate away from the heat source 5.Generally, heat spreaders 7 are ideal for electronics systems thatexpect to operate under extreme shock and vibration, or systems thatneed to be completely sealed inside a container to be protected from theenvironment. Understandably, the performance of the heat sink 2 and theheat spreader 7, and thus the heat source 2 (such as a processor) may besubstantially influenced by performance of the thermal interfacematerial (TIM) 10.

It may be readily apparent that in the heat management system 1 of FIG.1, having thermal interface material (TIM) 10 available as a pad mayspeed assembly and provide for consistent quality. That is, for example,dispending thermal interface material (TIM) 10 in the form of a greaseor paste will require volume control as well as consistent spreading. Incontrast, by designing the thermal interface material (TIM) 10 forimplementation as a pad having suitable physical properties, superiorquality control may be achieved.

Referring to FIG. 2, an example thermal interface material (TIM) 101 isshown. The TIM 101 is formed as a pad or sheet 102 extending between afirst major surface 103 (as shown the bottom surface) and a second majorsurface 104 (as shown the top surface). Although a flat sheet is shown,it will be apparent to one skilled in the art that other shapes may beused, such as a curved sheet, or a sheet cut to custom shape anddimensions as desirable for a given application.

The sheet 102 is formed of a base material 105 with a thermallyconductive filler material 106 embedded in the base material.

The base material 105 may be a material chosen to have desiredmechanical and thermal properties. Numerous exemplary suitable materialsare set forth below. For the purpose of the depicted exemplaryembodiment, the base material will be considered to be an acrylic rubberor acrylic resin material. In some embodiments, the base material 105may be a mixture of components such as resin combined with a plasticizermaterial.

Advantageously, in some embodiments, the base material may be free orsubstantially free of silicones or other siloxane-based polymers whichare known to exhibit degradation, outgassing, and other undesirableproperties at high temperature.

As shown, the filler material 106 may include anisotropically orientedthermally conductive elements 107. The thermally conductive elements 107may be preferentially oriented along a primary direction from the firstmajor surface 103 towards the second major surface 104 (as shown, thevertical direction) to promote thermal conduction though the sheet alongthe primary direction.

In some embodiments, the inclusion of the filler provides for excellentthermal conductivity through the sheet 102 along the primary direction.For example, in some embodiments, the thermal conductivity of the sheetalong the primary direction is at least 10 W/mK, 15 W/mK 30 W/mK, 40W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more. Insome embodiments, the thermal conductivity may be measured using theASTM standard D5470 known in the art.

In some embodiments, the TIM 101 exhibits excellent thermal impedance asa function of applied pressure. For example, in some embodiments thisproperty may be measured using the techniques described in the ASTMstandard D5470 known in the art, resulting in a thermal impedance at 10psi pressure of less than 0.1° C.-inch²/W, 0.09° C.-inch²/W, 0.08°C.-inch²/W, 0.07° C.-inch²/W, 0.05° C.-inch²/W, or less (e.g., for asheet with thickness in the range of 0.5 mm to 5.0 mm). For example, insome embodiments this property may be measured using the techniquesdescribed in the ASTM standard D5470 known in the art, resulting in athermal impedance at 30 psi pressure of less than 0.06° C.-inch²/W,0.05° C.-inch²/W, 0.04° C.-inch²/W, 0.03° C.-inch²/W, 0.02° C.-inch²/W,0.01° C.-inch²/W or less (e.g., for a sheet with thickness in the rangeof 0.5 mm to 5.0 mm).

In some embodiments, the sheet 102 may be self-supporting, e.g., formedfrom a flexible polymer resin base material 105. In some embodiments,the sheet may have a thickness in the range of 0.1 mm to 10 mm, or anysubrange thereof, e.g., 0.5 mm to 5.0 mm. In some embodiments, TIM 101may exhibit at Shore hardness in the range of 40 to 90 or any subrangethereof such as of 50 to 80 or 60 to 70, as determined by the techniquesset forth in ASTM D2240 (Shore 00).

In some embodiments the TIM 101 may have a density in the range of 0.5g/mL to 5.0 g/mL or any subrange thereof, e.g., 1.0 g/mL to 2.0 g/mL. Insome embodiments, the TIM 101 may have a density of about 1.7 g/mL.

In some embodiments, the TIM 101 exhibits desirably high deflection as afunction of applied pressure. In some such embodiments, this propertyallows for excellent thermal contact between the TIM 101 and otherthermal sources and sinks in applications where pressure is applied. Insome deflection as a function of compression may be measured using thetechniques of the ASTM D5470 and ASTM C165 standards known in the art.In some embodiments, the TIM 102 exhibits a deflection of at least 10%,20%, 30%, 40%, 50%, 60%, or more at a compression pressure of 30 psi,and a deflection of at least 30%, 40%, 50%, 60%, 70%, 80%, or more at apressure of 50 psi.

In some embodiments, the TIM 101 can operate at temperature in the rangeof −40° C. to 150° C. without significant degradation. For example, insome embodiments the TIM 101 exhibits a total mass loss of less than0.2% at temperatures at or above 150° C., 160° C., 170° C., 180° C., ormore under thermogravimetric analysis using the techniques set forth inthe ASTM E595 standard known in the art.

In some embodiments, the filler material may include ceramic flakes suchas boron nitride flakes. In some embodiments, the filler material mayinclude boron nitride nanoflakes or nanoscrolls.

In some embodiments, the filler material may include carbons such asgraphite flakes or graphene flakes. In some embodiments, the fillermaterial may include carbon nanotubes, bundles of carbon nanotubes, andagglomerates of aligned carbon nanotubes. Other suitable examples offiller material are presented in the examples below.

In some embodiments, the anisotropically oriented thermally conductiveelements include flake shaped elements having a major surface, and atleast 65%, 75%, 85%, 95%, 99% or more of the flake shaped elements arealigned such that the major surface substantially lies in a planeextending along the primary direction transverse to the first and secondsurfaces of the sheet. For example, as show in FIG. 2, the vast majorityof the conductive elements are oriented such that the major surface ofthe flakes are oriented transverse to the top and bottom surface.

In some embodiments, the anisotropically oriented thermally conductiveelements include elongated elements (e.g., carbon nanotubes) having amajor dimension and one or more minor dimensions and wherein at least65%, 75%, 85%, 95%, 99% or more of the elongated elements are alignedsuch that the major dimension extends along the primary directiontransverse to the first and second surfaces of the sheet.

In various embodiments, the amount of filler material used may beselected to result in desired properties. In general, a larger amount offiller will tend to provide higher thermal conductivity (providedsufficient care in taken to ensure that the filler does not result inunwanted surface roughness, as detailed below). In some embodiments, thefiller is at least 20%, 30% 40%, 50%, 60%, 70%, 80%, 90%, 95% or more byweight of the sheet.

Referring to FIG. 3, in some embodiments, the presence of the fillermaterial elements 107 embedded in the base material 105 may result inunwanted roughness of one or both of the major surfaces 103, 104 (104 isshown). In some such embodiments, the surface 104 may be treated toprovide a smother surface, better suited for good thermal contact withobjects such as heat sources and sinks, thereby reducing thermalimpedance.

For example, in some embodiments, a solvent 110 may be applied (e.g.,sprayed via a nozzle) onto the surface 104 to partially dissolve thebase material. In embodiments where the base material 105 is an acrylicresin, isopropyl alcohol (IPA) is a suitable solvent choice. Pressuremay then be applied to surface (e.g. using a mechanical roller orsimilar technique), smoothing the base material 105 and re-orienting thefiller material elements 107 near the surface 104 to provide a smootherinterface.

In some embodiments, following this surface treatment, the sheet 102 caninclude a region 112 proximal the first major surface 103 (not shown)and/or second major surface 104 (shown) of the sheet where the fillermaterial elements 107 have been reoriented. This region 112 may thencontain a subset of the thermally conductive elements 107 of the filler106 are that less anisotropically oriented than the thermally conductiveelements located more distal to the surface in the inner portion of thesheet. For example, with the base material 105 at least partiallydissolved, the filler 106 in the region 112 may be freed to return to amore isotropic orientation.

Alternatively, the region 112 may then contain a subset of the thermallyconductive elements 107 of the filler 106 are that anisotropicallyoriented along a different direction than the thermally conductiveelements 107 located more distal to the surface in the inner portion ofthe sheet 102. For example, the pressure applied by a rolling elementmay cause the elements 107 near the surface 104 to be oriented flatalong the surface rather than extending transverse to the surface.

In some embodiments, heat may be applied to the surface 103, 104 insteadof or in addition to the solvent 110 to soften or melt the base materialin the region 112.

In some embodiments, additionally or in the alternative to the surfacetreatments described above, a thin layer of adhesive material (notshown) may be applied to the surface 103, 04 (e.g., using a spraynozzle). The adhesive layer can fill in surface roughness and promoteadhesion of the TIM 101 to heat sources or sinks. In some embodiments,the adhesive material may include a space filling material (e.g., amaterial otherwise suitable for use as the base material, such as anacrylic rubber). For example, in some embodiments the space fillingmaterial may be dissolved in a solvent and sprayed on to the surface 104to fill in gaps, cracks, indentations of the like in the surface 104. Insome examples, the solvent may then dry, leaving the space fillingmaterial behind, thereby creating a smoother surface 103, 104 on thesheet 102.

FIG. 4 illustrates the benefits of the solvent based surface treatmentdescribed above. Six samples of the TIM 101 were made, each having athickness of 1.0 mm. The samples were tested for thermal impedance atvarious pressures, using the techniques set forth in the ASTM standardD5470 know in the art. Three of the samples underwent surface treatmentto improve surface treatment, three did not. As shown in FIG. 4, thethermal impedance for the treated samples (lower traces) was less thanthat of the untreated samples (upper traces), especially at lowpressure. This clearly indicates that the surface treatment promotesbetter thermal contact between the TIM 101 and the heat sources andsinks used in the evaluation.

Referring to FIG. 5, in some embodiments, the TIM 101 includes thermallyconductive elements 120 extending through the sheet 102 from the firstmajor surface 103 to the second major surface 104 along the primarydirection (as shown the vertical direction). These thermally conductiveelements may promote heat flow between the surfaces 103, 104. In someembodiments, these elements 120 may be made of carbon. For example,graphite or graphene formed as sheets, strips, pillars, or othersuitable shapes may be used.

In some embodiments, a portion of the thermally conductive elements maybe exposed at the first and second major surfaces 103, 104 of the sheet102. In some such cases it may be desirable to treat the surface toprotect these regions, e.g., by using the solvent based surfacetreatment described above, or by applying a thin protective adhesivelayer to the surfaces 103, 104.

Referring to FIGS. 6A and 6B, an exemplary method for fabricating theTIM 101 is shown.

Referring to FIG. 6A, a stack 500 is formed at includes a plurality oflayers 501.

Each layer 501, as shown each layer 501 extends from a bottom surface502 to a top surface 503 along a direction (as shown, the verticaldirection), and the layers are stacked one above the other in thatdirection.

Each layer 501 includes a base material 105, and a filler material 106of the type described above with reference to FIG. 2. The fillermaterial 106 in each layer is made up of anisotropically orientedthermally conductive elements 107. However, unlike in the sheet 102 usedin the final TIM 101, the elements 107 are oriented to promote heat flowdirections transverse to the vertical direction from the bottom surface502 to the top surface 503 rather than along it. Accordingly, theselayers 501 in the stack are not suitable for use as the TIM 101 withoutfurther processing.

Referring to FIG. 6B, accordingly, in some embodiments, force may beapplied (optionally along with heat) in the vertical direction tocompress the stack 500 to cause the layers 501 to join together to forma monolithic element. The stack 501 may be sliced, e.g. using a fineblade, or ultrasonic or laser cutting along a plane extending in thevertical direction (indicated in FIG. 6B with a heavy dark arrow) toform a sheet 102 of a desired thickness. This sheet 102 is removed fromthe stack, and forms TIM 101. Notably, the TIM 101 now includes a sheet102 having filler material 106 made up of anisotropically orientedthermally conductive elements 107 oriented in the proper direction. Thatis, the sheet 102 extends between a first major surface 103 and ansecond major surface 104, and the filler material 106 includesanisotropically oriented thermally conductive elements 107 that arepreferentially oriented along a primary direction from the first majorsurface 103 towards the second major surface 104 to promote thermalconduction though the sheet 102 along the primary direction.

Additional slices may be taken to generate additional TIM 101 pads. Inother words, the stacking and slicing process described above takes aplurality of layers in which the filler material has an anisotropicorientation in a direction unsuitable for use as a TIM 101, andgenerates a number of TIM 101 pads with the filler having the desiredorientation.

As described in detail below, the layers 501 can be generated using asimple process suitable for mass production techniques. For example, insome embodiments each stack layer 501 can be formed by providing amixture of base material and filler material that includes the thermallyconductive elements. In general, this mixture can be made without takingany steps to orient the filler material, resulting in an isotropicdistribution of the thermally conductive elements in the base material.The resulting mixture can then be physically manipulated to cause thethermally conductive elements to become anisotropically oriented withinthe layer. For example, as described in detail in the additionalexamples below, the mixture can be extruded to form the layers 501,compressed to form the layers 501, repeatedly folded on itself to formthe layer 501, or combinations thereof.

As described above, this physical manipulation will result in a layerhaving anisotropically oriented thermally conductive elements 107oriented in an undesirable direction for use in the TIM 101. However,this can be rectified by performing the stacking, compression, andslicing steps describe above with reference to FIGS. 6A and 6B

In some embodiments, the base material 105 is a self-healing material,thereby promoting the melding of the layers 501 into a monolithicelement during the compression step provided above. Self healingmaterials are also advantageous in that they resist damage (e.g.,cracking) that may occur during the slicing step described above withreference to FIG. 6B.

In various embodiments, the method may further include applying asurface treatment to one or more of the major surfaces 103, 104 of theTIM 101, as described above with reference to FIG. 3.

Referring to FIGS. 7A and 7B, the above process can be easily modifiedto produce the alternate version of TIM 101 shown in FIG. 5. In someembodiments, conductive elements, e.g., carbon elements 510 areinterleaved between a least some of the layers 501 in the stack 501prior to the steps of compressing and slicing the stack.

The carbon elements may include graphite or graphene and may be formedas sheets (e.g., extending continuously across the surface of the layers501) or strips (e.g. covering only portions of the layers 501) or anyother suitable shape. In some embodiments, the carbon elements 501 maybe formed of graphite or graphene.

As shown in FIG. 7B, once the stack 500 is sliced to form the sheet 102of the TIM 101, portions of the carbon elements 520 form the thermallyconductive elements 120 extending through the sheet 102 from the firstmajor surface 103 to the second major surface 104 as descried above withreference to FIG. 5

As will be apparent to one skilled in the art, the above process can bereadily adapted to provide a TIM 101 of any of the types describedherein.

Note that although FIGS. 6A-7A show a specific number of layers 501 andconductive elements 510, and suitable number may be used. For example,some embodiments use 2, 3, 4, 5, 10, 15, 20 or more layers 501, e.g., inthe range of 2-100 layers or a subrange thereof.

Additional Examples

A process for fabrication of an exemplary TIM pad is set forth withregard to FIGS. 8-11. As will be apparent to one skilled in the art, theexemplary material and techniques describes herein may be readilyadapted for use in the previous examples a well.

The process for fabricating a pad of thermal interface material (TIM) 10begins with what is shown in FIG. 8.

In FIG. 8, a volume of a suitable thermally conductive composition 21 isshown. The thermally conductive composition 21 may include fillers forexample, metal powder and mixtures thereof (for example, aluminumpowder; silver powder; copper powder); graphite flakes, ceramic powder(for example, alumina; boron nitride and others). The composition 21 mayalso include a self supporting base material that includes materialssuch as rubbers (e.g., acrylic rubber), oils, polymers, thermoplasticresins and thermoset resins. Generally, the thermally conductivecomposition 21 may be fabricated from materials exhibiting suitableproperties. The properties may include, for example, pliability and goodthermal conductivity. A variety of other materials may be used.

In some embodiments, a thermoplastic resin that is substantially solidat room temperature is used. Some examples of suitable thermoplasticresins include, acrylic resin, epoxy resin, silicone resin, fluorineresin and the like. These may be used alone, or in combination withother materials (as practicable).

The thermoplastic resin may be used in combination with a solid.Thermoplastic polymers/resins which may be used include, for example,poly (2-ethylhexyl acrylate), 2-ethylhexyl acrylate-acrylic acidcopolymer, a polymethacrylic acid or its ester, an acrylic resin such asa polyacrylic acid or its ester; silicone resins; fluororesins;polyethylene; polypropylene; ethylene-propylene copolymer;polymethylpentene; polyvinyl chloride; polyvinyl acetate; ethylene-vinylacetate copolymer; polyvinyl alcohol; polyacetal; polyethyleneterephthalate; polyethylene; polystyrene; polyacrylonitrile; -styreneacrylonitrile copolymer; acrylonitrile-butadiene-styrene (ABSresin)-copolymer; styrene butadiene block copolymer or its hydrogenatedproduct; styrene-isoprene block co-polymer copolymer or its hydrogenatedproduct; polyphenylene ether; modified polyphenylene ether; aliphaticpolyamide; and aromatic polyamides; polyamide; polycarbonate;polyphenylene sulfide; polysulfone; polyethersulfone; polyethernitrile;polyetherketones; polyketone; polyurethane; liquid crystal polymer;ionomers; and the like. These may be used alone, or in combination withother materials (as practicable).

In some embodiments, a thermoplastic fluorocarbon resin is used. Thismay result in certain other advantages, such as improved heatresistance, oil resistance, and chemical resistance.

Solid thermoplastic fluororesin that may be useful include, for example,vinylidene fluoride, tetrafluoroethylene-propylene,tetrafluoroethylene-system or the like, fluorine-containingpolymerizable monomer of the resulting elastomer and the like. Morespecifically, a poly-tetrafluoroethylene, atetrafluoroethylene-perfluoroalkylvinyl ether copolymer,tetrafluoroethylene-hexafluoropropylene copolymer,tetrafluoroethylene-ethylene copolymer, polyvinylidene fluoride,polychlorotrifluoroethylene, ethylene-copolymer,tetrafluoroethylene-copolymer, polyvinylfluorides,tetrafluoroethylene-propylene copolymer,tetrafluoroethylene-hexafluoropropylene copolymer, acrylic-modifiedpolytetrafluoroethylene, polytetrafluoroethylene modified ester,epoxy-modified silane-modified polytetrafluoroethylene andpolytetrafluoroethylene and the like.

Additional materials that may be used as the thermoset resin include,for example, natural rubber; acrylate rubber; butadiene rubber; isoprenerubber; nitrile rubber; hydrogenated nitrile rubber; chloroprene rubber;ethylene-propylene rubber; chlorinated polyethylene; chlorosulfonatedpolyethylene; butyl rubber; halogenated butyl rubber; polyisobutylenerubber; poly acrylic rubber; epoxy resin; a polyimide resin; abismaleimide resin; benzocyclobutene resin; a phenol resin; unsaturatedpolyester; a diallyl phthalate resin; a polyimide resin; a polyurethane;a thermosetting polyphenylene ether; thermosetting polyphenylene ether;and the like.

In some embodiments, the thermally conductive composition 21 includespoly(vinyl acetate) (PVA) or poly(ethenyl ethanoate) (PVAc). Generally,PVA is an aliphatic rubbery synthetic polymer with the formula(C4H6O2)_(n). PVA belongs to the polyvinyl esters family, with thegeneral formula —[RCOOCHCH₂]— and is a type of thermoplastic. In someembodiments, the thermally conductive composition 21 is a non-siliconebase material. One additional example includes a soy-oil base material.

Any of the foregoing materials may be used alone, or in combination withthese or other materials (as practicable).

Disposed within the thermally conductive composition 21 is a dispersionof thermal fillers. The thermal fillers may be provided as nanomaterialsand/or micromaterials.

Generally, the thermal fillers exhibit some shape or form, and thereforehave at least one dimensional aspect (e.g., thin flakes having a majorsurface and on minor dimension or elongated elements having one majordimension and two transverse minor dimensions). The thermal fillers maybe selected for dispersion and exhibit good to excellent thermalconductivity. Some examples of nanomaterials include, withoutlimitation, such as forms of carbon nanotubes (including single-wallcarbon nanotubes (SWCNT) and multi-wall carbon nanotubes (MWCNT)) aswell as nanohorns, nano-onions, carbon black, fullerene, graphene,oxidized graphene, and various treated forms of the foregoing. In someembodiments, the nanomaterials further include metal nano-particles,metal oxide nano-particles, and/or at least one form of thermallyconductive polymer. The thermal fillers may be provided asmicromaterials and include, without limitation, graphite, boron nitride,boron nitride flakes, boron nitride nanoscrolls, aluminum nitride,aluminum nitride whiskers, carbon nanotubes, metal particles, metaloxide particles and/or at least one form of thermally conductivepolymer.

As used herein, the term “micromaterials” refers to dimensional thermalfiller materials that exhibit one or more dimension in the range ofabout 0.1 microns up to about 200 microns (e.g., microscale particles orflakes). Generally, the term “nanomaterials” refers to dimensionalthermal filler materials that exhibit a one or more dimensions in therange of about a few nanometers up to about 100 nanometers (0.1 microns)(e.g., nanotubes, nanorods, nanoparticles, nanoshells, nanohorns, andnanoscopic flakes such as graphene flakes).

Given the diminutive nature of the thermal fillers, in some embodiments,it is not possible to control orientation when mixing them into thethermally conductive composition 21. Accordingly, dispersion of thethermal fillers results in randomly oriented dimensional material 22disposed within the volume of the thermally conductive composition 21.

As the thermal fillers are randomly oriented within the thermallyconductive composition 21, advantageous properties of directionalthermal conductivity are absent. More specifically, and as shown in FIG.8 by the directional arrows, without a directional arrangement, theisotropic thermal conductivity preference of the thermal fillers causesheat to be conducted away in random directions. The potential of thethermal fillers may be taken advantage of, however, when rearranging thedimensional thermal fillers in an anisotropic orientation to form anoriented material 100, as shown in FIG. 9.

As shown in FIG. 9, the thermal fillers dispersed in the thermallyconductive composition 21 may be arranged as directionally orienteddimensional material 32 in the oriented material layer 100, e.g.,suitable for use as layers 501 in the stack and slice process describedabove with reference to FIGS. 6A through 7B.

Exemplary techniques for providing oriented dimensional material 32include hydraulic pressing or extrusion. In some embodiments, hydraulicpressing begins with a volume of thermal conductive composition 21having a dispersion of randomly oriented dimensional material 22. Thevolume of material is pressed or extruded into a substantially planarform. In some embodiments, the substantially planar form is then foldedonto itself, effectively being reshaped, e.g., into a ball or cubicvolume. The volume of material is then again pressed into asubstantially planar form. Generally, through repeated pressing andfolding, the filler materials disposed in random orientation areencouraged into a planar orientation, e.g., as shown above in the layers501 in reference to FIG. 6A or FIG. 6B.

In order to encourage migration of the filler materials into the desiredorientation, the mixture of the thermally conductive composition 21 withthe dispersion of randomly oriented dimensional material 22 may beheated, e.g., during a pressing or extrusion process as described above.Generally, heating of the mixture of the thermally conductivecomposition 21 with the dispersion of randomly oriented dimensionalmaterial 22 decreases the viscosity of the thermally conductivecomposition 21, thereby encouraging migration of the randomly orienteddimensional material 22 into the desired orientation.

As shown in FIG. 9 by the directional arrows, when the dimensionalmaterials 32 are provided in a directional arrangement, the anisotropicthermal conductivity preference of the nanomaterials generally causesheat to be conducted away in the X-Y plane. This property is takenadvantage of to provide for thermal pad disclosed herein. In someembodiments.

As shown in FIG. 10, the oriented material 100 may be segmented andplaced into a stack 40. Once in the stack 40, the oriented thermalinterface material (TIM) 100 may be further segmented. For example, thestack 40 may be cut along an imaginary plane, denoted as the A-plane,which is in the X-Z plane. The result is depicted in FIG. 11.

As shown in FIG. 11, an oriented pad 50 includes a portion of the stack40 shown in FIG. 4. Generally, the oriented pad 50 is fabricated todimensions suited for use in the heat management system 1 illustrated inFIG. 1. The resulting vectors substantially convey heat from the heatsource 5 through the X-Y plane. While some of the thermal fillers willconvey heat substantially in the X direction, it is expected that asubstantially equivalent portion of the nanomaterials will convey heatsubstantially in the Y direction. Stated another way, while theanisotropic thermal conductivity of the thermal fillers causes asubstantial portion of the heat to be conveyed through the X-Y plane,conveyance of heat in the Z direction is limited (for the same reason).Thus, there is limited recirculation of heat within the oriented pad 50.

Performance of the thermal conductivity of the oriented pad 50 wasevaluated in a series of tests using a standardized test bench. Testingincluded comparison to competitive products. When placed in the testbench, each product experienced some compression. The compressionexhibited is set forth in Table 1 below. In the data table below, “NaLPad” refers to the oriented pad 50. Test data for evaluation of thermalconductivity is presented in FIG. 12.

TABLE 1 Compression of comparative products TIM Thickness (mm) ChangeDescription Before After (%) t-Global, 2 w/mK 1.94 1.87 −3.61 t-Global,6 w/mK 2.03 2.025 −0.25 Panasonic, 13 w/mK 2.02 2 −0.99 Fujipoly, 17w/mK 1.5 1.475 −1.67 NaL Pad, Rough 1.755 1.69 −3.70 NaL Pad, Flat 1.361.35 −0.74

As shown in FIG. 12, the resulting oriented pad 50 outperforms allcompeting pad products tested. The data shows that thermal conductivityperformance of the oriented pad 50 is substantially equivalent tothermal performance of potting material (i.e., jacketing of the heatsource 5 with potting material).

In FIG. 13, a comparison showing the effects realized from orientationof the dimensional thermal materials is shown. In the heat managementsystem 1 used to generate the data shown, the heat spreader 7 wasomitted. Three samples of thermal interface material 10 were tested. Thefirst sample included a standard (STD) with substantially verticallyoriented thermal filler materials. A difference in temperature betweenthe heat source 5 and the heat sink 2 reached equilibrium quickly andmaintained at about 5° C. The second sample of thermal interfacematerial 10 (45 deg) was fabricated using a slicing technique describedherein, with slicing occurring at an angle of about 45 degrees. Thethird sample of thermal interface material 10 contained thermal fillermaterials that were oriented substantially orthogonally (90 deg) to thedesired direction of heat flux.

Exhibiting a smaller temperature difference between the heat source 5and the heat sink 2 indicates lower thermal resistivity. Thus, since thefirst sample has the smallest temperature difference, it is clear thatorienting the particles such that heat is transferred through the X-Yplane (as defined in FIG. 11) improves the thermal conductivity of thethermal interface material 10.

Having introduced aspects of thermal interface materials, some furtheraspects and examples are provided.

The thermal interface materials may be formed as a soft material.Generally, the thermal interface material is self-healing duringfabrication (the slice-and-stack procedure).

Generally, the thermal interface material is useful in applicationsrequiring gap filling. That it, the thermal interface materials providefor superior conformity to irregular surfaces.

In some embodiments, the thermal interface materials include a flexiblepolymer sheet material with thickness options from about 0.25 mm toabout 5 mm, and a thermal conductivity of up to about 60 W/mK or more.Current high-performance TIM sheets tend to be around 5 W/mK. Theresulting four-fold increase in performance is an enabling technologyfor applications using high power. Virtually any powered system couldtake advantage of a high performance TIM.

Applications for thermal interface materials include, withoutlimitation: power supplies, automotive electronics, motor controls,power semiconductors, heat sink interfaces, processing systems and otherelectronic devices such as computers, amplifiers, video processingequipment, control systems and many others.

In some embodiments, the resulting product exhibits thermal conductivitythat is at least 60 W/mK. The product may be provided in a sheet, insome embodiments, in sheets sized roughly the size of standard printerpaper. The product may have a thickness of between about 0.25 mm to 5 mmand may be lesser or greater in thickness. The product may be useful intemperatures ranging between −60° C. to 250° C. (or any subrangethereof, e.g., −40° C. to 150° C.). and may be useful in temperatureranges lesser or greater. Generally, the product is non-outgassing anddoes not exhibit creep with thermal cycling. Generally, the product ispliable and conforming to surrounding components. Generally, the productis reworkable and may be use in existing/common manufacturing processes.

Various other components may be included and called upon for providingfor aspects of the teachings herein. For example, additional materials,combinations of materials and/or omission of materials may be used toprovide for added embodiments that are within the scope of the teachingsherein.

A variety of modifications of the teachings herein may be realized.Generally, modifications may be designed according to the needs of auser, designer, manufacturer or other similarly interested party. Themodifications may be intended to meet a particular standard ofperformance considered important by that party.

The appended claims or claim elements should not be construed to invoke35 U.S.C. § 112(f) unless the words “means for” or “step for” areexplicitly used in the particular claim.

When introducing elements of the present invention or the embodiment(s)thereof, the articles “a,” “an,” and “the” are intended to mean thatthere are one or more of the elements. Similarly, the adjective“another,” when used to introduce an element, is intended to mean one ormore elements. The terms “including” and “having” are intended to beinclusive such that there may be additional elements other than thelisted elements. As used herein, the term “exemplary” is not intended toimply a superlative example. Rather, “exemplary” refers to an embodimentthat is one of many possible embodiments.

While the invention has been described with reference to exemplaryembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted forelements thereof without departing from the scope of the invention. Inaddition, many modifications will be appreciated by those skilled in theart to adapt a particular instrument, situation or material to theteachings of the invention without departing from the essential scopethereof. Therefore, it is intended that the invention not be limited tothe particular embodiment disclosed as the best mode contemplated forcarrying out this invention, but that the invention will include allembodiments falling within the scope of the appended claims.

1-40. (canceled)
 41. A thermal interface material comprising: a sheetextending between a first major surface and a second major surface, thesheet comprising a mixture of: a base material comprises thermoplasticmaterial and is a self-supporting flexible layer selected forencouraging migration of filler material disbursed therein into adesired orientation; and filler material that is at least fifty percentby weight of the sheet, the filler material disbursed in the basematerial, the filler material comprising anisotropically orientedthermally conductive elements; wherein the thermally conductive elementsare preferentially oriented along a primary direction from the firstmajor surface towards the second major surface to promote thermalconduction though the sheet along the primary direction; wherein thebase material is substantially free of silicone; wherein the sheetcomprises a slice separated from a stack of a plurality of layers ofbase material compressed together; each of the layers is embedded withthe filler material, and wherein the filler material in each layercomprises anisotropically oriented thermally conductive elements and theorientation of the slice during separation from the stack is such thatthe thermally conductive elements are oriented along a primary directionfrom the first major surface towards the second major surface to promotethermal conduction though the sheet along the primary direction and thesheet comprises a region proximal the first major surface or secondmajor surface of the sheet, said region containing a subset of thethermally conductive elements of the filler are that lessanisotropically oriented than the thermally conductive elements locatedmore distal to said surface; wherein at least one of the first majorsurface and the second major surface of the sheet comprise a surfaceregion treated with solvent to promote surface smoothness; wherein theanisotropically oriented thermally conductive elements comprise flakeshaped elements having a major surface, and wherein at least 65% of saidflake shaped elements are aligned such that the major surfacesubstantially lies in a plane extending along the primary directiontransverse to the first and second surfaces of the sheet; wherein thethermal conductivity of the sheet along the primary direction is atleast 20 W/mK.
 42. The thermal interface material of claim 41, whereinthe sheet exhibits self-healing properties.
 43. The thermal interfacematerial of claim 41, wherein the base material comprises at least oneof acrylic rubber, acrylic resin, epoxy resin, a thermoplasticfluorocarbon and fluorine resin.
 44. The thermal interface material ofclaim 41, wherein the base material comprises at least one of: poly(2-ethylhexyl acrylate), 2-ethylhexyl acrylate-acrylic acid copolymer, apolymethacrylic acid or its ester, an acrylic resin such as apolyacrylic acid or its ester; silicone resins; fluororesins;polyethylene; polypropylene; ethylene-propylene copolymer;polymethylpentene; polyvinyl chloride; polyvinyl acetate; ethylene-vinylacetate copolymer; polyvinyl alcohol; polyacetal; polyethyleneterephthalate; polyethylene; polystyrene; polyacrylonitrile; -styreneacrylonitrile copolymer; acrylonitrile-butadiene-styrene resin; styrenebutadiene block copolymer; hydrogenated product of styrene butadieneblock copolymer; styrene-isoprene block co-polymer copolymer;hydrogenated product of styrene-isoprene block co-polymer copolymer;polyphenylene ether; modified polyphenylene ether; aliphatic polyamide;and aromatic polyamides; polyamide; polycarbonate; polyphenylenesulfide; polysulfone; polyethersulfone; polyethernitrile;polyetherketones; polyketone; polyurethane; liquid crystal polymer;ionomers; and combinations thereof.
 45. The thermal interface materialof claim 41, wherein the base material comprises at least one of:vinylidene fluoride, tetrafluoroethylene-propylene, fluorine-containingpolymerizable monomer, an elastomer resulting from fluorine-containingpolymerizable monomer; a poly-tetrafluoroethylene, atetrafluoroethylene-perfluoroalkylvinyl ether copolymer,tetrafluoroethylene-hexafluoropropylene copolymer,tetrafluoroethylene-ethylene copolymer, polyvinylidene fluoride,polychlorotrifluoroethylene, ethylene-copolymer,tetrafluoroethylene-copolymer, polyvinylfluoride,tetrafluoroethylene-propylene copolymer,tetrafluoroethylene-hexafluoropropylene copolymer, acrylic-modifiedpolytetrafluoroethylene, polytetrafluoroethylene modified ester,epoxy-modified silane-modified polytetrafluoroethylene andpolytetrafluoroethylene.
 46. The thermal interface material of claim 41,wherein the base material comprises at least one of: natural rubber;acrylate rubber; butadiene rubber; isoprene rubber; nitrile rubber;hydrogenated nitrile rubber; chloroprene rubber; ethylene-propylenerubber; chlorinated polyethylene; chlorosulfonated polyethylene; butylrubber; halogenated butyl rubber; polyisobutylene rubber; polyacrylicrubber; epoxy resin; a polyimide resin; a bismaleimide resin;benzocyclobutene resin; a phenol resin; unsaturated polyester; a diallylphthalate resin; a polyimide resin; a polyurethane; a thermosettingpolyphenylene ether; and thermosetting polyphenylene ether.
 47. Thethermal interface material of claim 41, wherein the base materialcomprises at least one of: poly(vinyl acetate) (PVA); poly(ethenylethanoate) (PVAc); and a soy-oil base material.
 48. The thermalinterface material of claim 41, wherein the base material is at leastpartially dissolved in a solvent when the filler material is disbursedtherein.
 49. The thermal interface material of claim 48, wherein thesolvent comprises isopropyl alcohol.
 50. The thermal interface materialof claim 41, wherein the filler material comprises at least one of:carbon nanotubes, bundles of carbon nanotubes, agglomerates of alignedcarbon nanotubes; ceramic flake; nano-horns, nano-onions, carbon black,fullerene, graphene and oxidized graphene.
 51. The thermal interfacematerial of claim 41, wherein the filler material comprises at least oneof: metal nano-particles, metal oxide nano-particles, and a thermallyconductive polymer.
 52. The thermal interface material of claim 41,wherein the filler material comprises at least one of: graphite, boronnitride, boron nitride flakes, boron nitride nano-scrolls, aluminumnitride, aluminum nitride whiskers, carbon nanotubes, metal particles,metal oxide particles.
 53. The thermal interface material of claim 41,wherein the filler material further comprises a distribution of at leastone of microscale particles and flakes, wherein the distributioncomprises elements that exhibit at least one dimension in the range ofabout 0.1 microns up to 200 microns.
 54. The thermal interface materialof claim 41, wherein the thermal conductivity is at least 40 W/mK. 55.The thermal interface material of claim 41, wherein the thermalconductivity is at least 70 W/mK.
 56. The thermal interface material ofclaim 41, wherein the sheet further comprises at least one thermallyconductive element in thermal communication between and exposed at thefirst major surface and the second major surface.
 57. The thermalinterface material of claim 56, wherein the at least one thermallyconductive element comprises one of a sheet, a strip, a pillar andanother shape.
 58. The thermal interface material of claim 56, whereinthe at least one thermally conductive element comprises at least one ofcarbon, graphite and graphene.